The European Union – the media freedom hub marsrgi Thu, 03/19/2026 - 08:58 Opening: 16 April 2026 Closing: 28 May 2026 The overall goal of this preparatory action is to continue the activities of the ongoing Free Media Hub EAST project, i.e. to sustain and improve existing financial and other kinds of support to exiled independent media from Russia, Belarus, as well as media from Ukraine that has relocated in the EU, and to foster the coordination and consolidation of a pan-European platform or network of media hubs to promote the preservation of a pluralistic media environment. GettyImages © Mihajlo Maricic Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Media and democracy Media freedom and pluralism International relations Funding for Digital Actions to Support Ukraine Democracy in the digital age {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}
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— Sources secondairesThese rulings prohibit the entities from entering or doing business in the European Union.
In addition to enabling remote access, the malware supports a wide range of capabilities, including data theft and spying.
A sophisticated iOS exploit chain leverages multiple zero-day vulnerabilities and is targeting users in Saudi Arabia, Turkey, Malaysia, and Ukraine.
A prompt injection vulnerability paired with other flaws can turn a Google search into a full attack chain that could threaten enterprise networks.
Tracking pixels let social media companies spy on their users even after they click over to advertiser sites, gleaning credit card info, geolocations, and more, according to an analysis.
The suspected India-linked threat group targets governments, telecom, and critical infrastructure using spear-phishing, old vulnerabilities, and rapidly rotating infrastructure to maintain persistent access.
CEF-Digital Info Session: 2026 Calls Anonymous (not verified) Wed, 03/18/2026 - 10:35 26 March 2026 Online Learn more about the calls "Equipment for smart European cable systems" (CEF-DIG-2026-SMART-CABLES) and "Backbone connectivity for Digital Global Gateways" (CEF-DIG-2026-GATEWAYS). GettyImages © Dragon Claws Main link https://hadea.ec.europa.eu/events/cef-digital-info-session-2026-calls-2026-03-2… Related topics Connecting Europe Facility Funding for Digital Related content Press release 17 March 2026 Commission makes available €200 million for submarine cable and digital infrastructure projects The European Commission has opened two new Connecting Europe Facility (CEF) calls worth €200 million for projects in high-capacity networks, including submarine cables. {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}
Credential theft soared in the second half of 2025, thanks in part to the industrialization of infostealer malware and AI-enabled social engineering.
When technical expertise meets clear communication, cybersecurity teams thrive. Learn how to foster trust and collaboration across diverse working groups.
Ransomware actors are ditching Cobalt Strike in favor of native Windows tools, as payment rates hit record lows and data theft surges.
In an unsuccessful phishing attack, threat actors leveraged trusted brands and domains to try to redirect a C-suite executive at Outpost24 to give up his credentials.
In a recent attack, the group showcased stealthier cross-network activity, thanks to its use of a new BYOVD technique and other tools.
Equipment for smart European cable systems - Works Anonymous (not verified) Tue, 03/17/2026 - 08:45 Opening: 17 March 2026 Closing: 30 June 2026 This call supports the upgrade of existing submarine telecommunications/digital infrastructures to “smart capabilities” enabling applications that monitor them as well as other surrounding critical infrastructures (e.g. power cables, pipelines, etc.) and/or their vicinity. Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}
Backbone connectivity for Digital Global Gateways - Studies Anonymous (not verified) Tue, 03/17/2026 - 08:19 Opening: 17 March 2026 Closing: 30 June 2026 This call for proposals will fund studies related to the deployment/significant upgrade of backbone networks that address risks, vulnerabilities and dependencies in the EU backbone infrastructure. GettyImages © Dragon Claws Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}
Researchers uncovered an extensive cyber espionage campaign that used novel backdoors and familiar evasion techniques to maintain persistent access to regional targets.
Dozens of updated, malicious GlassWorm extensions have infested Open VSX, threatening software development supply chains.
Discover how Franz Regul, former CISO for the Paris 2024 Olympics, tackled unique cybersecurity challenges to protect the Games from evolving threats.
A social engineering campaign impersonating PayPal and Amazon uses customer support interactions to acquire sensitive info.
Open EU Foundry status granted to innovative chiplet facility Anonymous (not verified) Mon, 03/16/2026 - 10:40 The Commission has granted the Open EU Foundry (OEF) status to Silicon Box in Novara, Italy. GettyImages © Nikola Ilic - E+ Under the European Chips Act, the OEF status is granted to new or upgraded innovative semiconductor manufacturing facilities. The status provides benefits to semiconductor facilities including administrative support, faster construction approvals and priority access to pilot lines under the Chips for Europe Initiative. This helps deepen European semiconductor supply chain resilience and boost innovation. Silicon Box’s project is a significant milestone in strengthening Europe’s semiconductor industry through its new advanced semiconductor packaging and testing facility. The facility will integrate multiple dies or chiplets - small, modular semiconductor blocks that perform specific functions - into a single package, effectively creating a multi-chip module that behaves like a single chip, using panel level packaging. Panel level packaging uses a more efficient large-panel approach to packaging, enabling higher output and lower cost compared to traditional methods in the final stage of the chip making process. The facility will also test chips at panel-level, grouping multiple chiplets into a single panel, enabling more comprehensive quality verification before final assembly. The project will provide an important base in Europe for developing innovative technologies, products and system solutions for the semiconductors key to powering AI, electric and autonomous vehicles, data centres, as well as supercomputing applications. The plant is expected to reach full capacity in 2033. This OEF status recognition follows four semiconductor projects across the EU which have previously been awarded OEF or IPF (integrated production facility) status in October 2025: ESMC in Germany (OEF) Ams-OSRAM in Austria (IPF) Infineon Technologies Dresden in Germany (IPF) STMicroelectronics in Italy The decision to grant OEF follows the Commission state aid decision concerning Silicon Box. Related topics Advanced Digital Technologies Electronics Chips Act Semiconductors {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}