Flux RSS

ShieldGuard Chrome extension posed as a crypto security tool but stole wallets and drained user data

Rapid7 says median time from publication to CISA KEV inclusion dropped to five days

The Vidar 2.0 infostealers is deployed through fake free game cheats on GitHub and Reddit

Latest update on the AML/CFT standardised data collection

Gartner has urged security teams to get involved in AI projects from the start to avoid costly incident response

CEF-Digital Info Session: 2026 Calls Anonymous (not verified) Wed, 03/18/2026 - 10:35 26 March 2026 Online Learn more about the calls "Equipment for smart European cable systems" (CEF-DIG-2026-SMART-CABLES) and "Backbone connectivity for Digital Global Gateways" (CEF-DIG-2026-GATEWAYS). GettyImages © Dragon Claws Main link https://hadea.ec.europa.eu/events/cef-digital-info-session-2026-calls-2026-03-2… Related topics Connecting Europe Facility Funding for Digital Related content Press release 17 March 2026 Commission makes available €200 million for submarine cable and digital infrastructure projects The European Commission has opened two new Connecting Europe Facility (CEF) calls worth €200 million for projects in high-capacity networks, including submarine cables. {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

Android’s LSPosed-based attack hijacks payment apps via runtime manipulation and SIM-binding bypass

CursorJack shows how malicious MCP deeplinks in Cursor IDE can trigger user-approved code execution

Armis reveals that “mutually assured disruption” is no longer preventing state-backed attacks

Akamai says 87% of organizations suffered an API-related security incident last year

The US Cyber Monitoring Center should be operational in 2027, said the UK CMC leadership

Equipment for smart European cable systems - Works Anonymous (not verified) Tue, 03/17/2026 - 08:45 Opening: 17 March 2026 Closing: 30 June 2026 This call supports the upgrade of existing submarine telecommunications/digital infrastructures to “smart capabilities” enabling applications that monitor them as well as other surrounding critical infrastructures (e.g. power cables, pipelines, etc.) and/or their vicinity. Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

Backbone connectivity for Digital Global Gateways - Studies Anonymous (not verified) Tue, 03/17/2026 - 08:19 Opening: 17 March 2026 Closing: 30 June 2026 This call for proposals will fund studies related to the deployment/significant upgrade of backbone networks that address risks, vulnerabilities and dependencies in the EU backbone infrastructure. GettyImages © Dragon Claws Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

Some of these campaigns are linked to Darcula, a Chinese-language phishing-as-a-service platform

CrackArmor AppArmor flaws let local Linux users gain root, break containers and enable DoS attacks

DNS-based attack in AWS Bedrock AgentCore lets AI sandboxes exfiltrate cloud data

The FBI wants to hear from gamers who have downloaded Steam titles containing malware

An issue with the Companies House website has put the personal and corporate information of millions at risk

Open EU Foundry status granted to innovative chiplet facility Anonymous (not verified) Mon, 03/16/2026 - 10:40 The Commission has granted the Open EU Foundry (OEF) status to Silicon Box in Novara, Italy. GettyImages © Nikola Ilic - E+ Under the European Chips Act, the OEF status is granted to new or upgraded innovative semiconductor manufacturing facilities. The status provides benefits to semiconductor facilities including administrative support, faster construction approvals and priority access to pilot lines under the Chips for Europe Initiative. This helps deepen European semiconductor supply chain resilience and boost innovation. Silicon Box’s project is a significant milestone in strengthening Europe’s semiconductor industry through its new advanced semiconductor packaging and testing facility. The facility will integrate multiple dies or chiplets - small, modular semiconductor blocks that perform specific functions - into a single package, effectively creating a multi-chip module that behaves like a single chip, using panel level packaging. Panel level packaging uses a more efficient large-panel approach to packaging, enabling higher output and lower cost compared to traditional methods in the final stage of the chip making process. The facility will also test chips at panel-level, grouping multiple chiplets into a single panel, enabling more comprehensive quality verification before final assembly. The project will provide an important base in Europe for developing innovative technologies, products and system solutions for the semiconductors key to powering AI, electric and autonomous vehicles, data centres, as well as supercomputing applications. The plant is expected to reach full capacity in 2033. This OEF status recognition follows four semiconductor projects across the EU which have previously been awarded OEF or IPF (integrated production facility) status in October 2025: ESMC in Germany (OEF) Ams-OSRAM in Austria (IPF) Infineon Technologies Dresden in Germany (IPF) STMicroelectronics in Italy The decision to grant OEF follows the Commission state aid decision concerning Silicon Box. Related topics Advanced Digital Technologies Electronics Chips Act Semiconductors {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

A new law enforcement operation against phishing and ransomware operators led to the takedown of 45,000 malicious IP addresses