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CEF-Digital Info Session: 2026 Calls
Gouvernance & RégulationEC Digital Strategyil y a 10 jours

CEF-Digital Info Session: 2026 Calls Anonymous (not verified) Wed, 03/18/2026 - 10:35 26 March 2026 Online Learn more about the calls "Equipment for smart European cable systems" (CEF-DIG-2026-SMART-CABLES) and "Backbone connectivity for Digital Global Gateways" (CEF-DIG-2026-GATEWAYS). GettyImages © Dragon Claws Main link https://hadea.ec.europa.eu/events/cef-digital-info-session-2026-calls-2026-03-2… Related topics Connecting Europe Facility Funding for Digital Related content Press release 17 March 2026 Commission makes available €200 million for submarine cable and digital infrastructure projects The European Commission has opened two new Connecting Europe Facility (CEF) calls worth €200 million for projects in high-capacity networks, including submarine cables. {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

Equipment for smart European cable systems - Works
Gouvernance & RégulationEC Digital Strategyil y a 11 jours

Equipment for smart European cable systems - Works Anonymous (not verified) Tue, 03/17/2026 - 08:45 Opening: 17 March 2026 Closing: 30 June 2026 This call supports the upgrade of existing submarine telecommunications/digital infrastructures to “smart capabilities” enabling applications that monitor them as well as other surrounding critical infrastructures (e.g. power cables, pipelines, etc.) and/or their vicinity. Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

Backbone connectivity for Digital Global Gateways - Studies
Gouvernance & RégulationEC Digital Strategyil y a 11 jours

Backbone connectivity for Digital Global Gateways - Studies Anonymous (not verified) Tue, 03/17/2026 - 08:19 Opening: 17 March 2026 Closing: 30 June 2026 This call for proposals will fund studies related to the deployment/significant upgrade of backbone networks that address risks, vulnerabilities and dependencies in the EU backbone infrastructure. GettyImages © Dragon Claws Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

Open EU Foundry status granted to innovative chiplet facility
Gouvernance & RégulationEC Digital Strategyil y a 12 jours

Open EU Foundry status granted to innovative chiplet facility Anonymous (not verified) Mon, 03/16/2026 - 10:40 The Commission has granted the Open EU Foundry (OEF) status to Silicon Box in Novara, Italy. GettyImages © Nikola Ilic - E+ Under the European Chips Act, the OEF status is granted to new or upgraded innovative semiconductor manufacturing facilities. The status provides benefits to semiconductor facilities including administrative support, faster construction approvals and priority access to pilot lines under the Chips for Europe Initiative. This helps deepen European semiconductor supply chain resilience and boost innovation. Silicon Box’s project is a significant milestone in strengthening Europe’s semiconductor industry through its new advanced semiconductor packaging and testing facility. The facility will integrate multiple dies or chiplets - small, modular semiconductor blocks that perform specific functions - into a single package, effectively creating a multi-chip module that behaves like a single chip, using panel level packaging. Panel level packaging uses a more efficient large-panel approach to packaging, enabling higher output and lower cost compared to traditional methods in the final stage of the chip making process. The facility will also test chips at panel-level, grouping multiple chiplets into a single panel, enabling more comprehensive quality verification before final assembly. The project will provide an important base in Europe for developing innovative technologies, products and system solutions for the semiconductors key to powering AI, electric and autonomous vehicles, data centres, as well as supercomputing applications. The plant is expected to reach full capacity in 2033. This OEF status recognition follows four semiconductor projects across the EU which have previously been awarded OEF or IPF (integrated production facility) status in October 2025: ESMC in Germany (OEF) Ams-OSRAM in Austria (IPF) Infineon Technologies Dresden in Germany (IPF) STMicroelectronics in Italy The decision to grant OEF follows the Commission state aid decision concerning Silicon Box. Related topics Advanced Digital Technologies Electronics Chips Act Semiconductors {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

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