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Backbone connectivity for Digital Global Gateways - Studies
Gouvernance & RégulationEC Digital Strategyil y a 13 jours

Backbone connectivity for Digital Global Gateways - Studies Anonymous (not verified) Tue, 03/17/2026 - 08:19 Opening: 17 March 2026 Closing: 30 June 2026 This call for proposals will fund studies related to the deployment/significant upgrade of backbone networks that address risks, vulnerabilities and dependencies in the EU backbone infrastructure. GettyImages © Dragon Claws Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

Bank built its own threat hunting agent because vendors can’t keep pace with new threats
Gouvernance & RégulationThe Register Securityil y a 13 jours

AI helped send weekly threat signal count from 80 million to 400 billion, then helped response time shrink from two days to 30 minutes Australia’s Commonwealth Bank built its own agentic AI threat hunting tools, because vendors are too slow to develop tools that can cope with emerging AI-powered threats, according to General Manager of Cyber Defence Operations Andrew Pade.…

Robotics surgical biz Intuitive discloses phishing attack
Gouvernance & RégulationThe Register Securityil y a 13 jours

Operations and hospital networks not affected, we're told Robotics-assisted surgical tech firm Intuitive said that unauthorized intruders gained access to some of its internal IT business applications after stealing an employee's credentials during a phishing attack.…

Cybercrime has skyrocketed 245% since the start of the Iran war
Gouvernance & RégulationThe Register Securityil y a 13 jours

Hacktivists use proxy services from Russia, China for 'billions of designed-for-abuse connection attempts' Cybercrime has skyrocketed since the start of the Iran war, according to Akamai, which reports a 245 percent increase in everything from credential harvesting attempts to automated reconnaissance traffic aimed at banks and other critical businesses.…

AI finally delivers those elusive productivity gains... for cybercriminals
GénéralThe Register Securityil y a 13 jours

Interpol says fraud schemes using the tech are 4.5x more profitable AI is apparently good for the bottom line if your business is crime. Financial fraud schemes carried out with the help of artificial intelligence are 4.5 times more profitable than those that aren't enhanced, according to Interpol's latest estimates.…

Flaw in UK's corporate registry let directors rummage through rival records
Gouvernance & RégulationThe Register Securityil y a 13 jours

Back button blunder in WebFiling service run by Companies House revealed confidential paperwork Companies House was forced to pull down its record-filing platform for the entire weekend to rectify a "security issue" that exposed the personal details of company directors and other data to any logged in users.…

Open EU Foundry status granted to innovative chiplet facility
Gouvernance & RégulationEC Digital Strategyil y a 13 jours

Open EU Foundry status granted to innovative chiplet facility Anonymous (not verified) Mon, 03/16/2026 - 10:40 The Commission has granted the Open EU Foundry (OEF) status to Silicon Box in Novara, Italy. GettyImages © Nikola Ilic - E+ Under the European Chips Act, the OEF status is granted to new or upgraded innovative semiconductor manufacturing facilities. The status provides benefits to semiconductor facilities including administrative support, faster construction approvals and priority access to pilot lines under the Chips for Europe Initiative. This helps deepen European semiconductor supply chain resilience and boost innovation. Silicon Box’s project is a significant milestone in strengthening Europe’s semiconductor industry through its new advanced semiconductor packaging and testing facility. The facility will integrate multiple dies or chiplets - small, modular semiconductor blocks that perform specific functions - into a single package, effectively creating a multi-chip module that behaves like a single chip, using panel level packaging. Panel level packaging uses a more efficient large-panel approach to packaging, enabling higher output and lower cost compared to traditional methods in the final stage of the chip making process. The facility will also test chips at panel-level, grouping multiple chiplets into a single panel, enabling more comprehensive quality verification before final assembly. The project will provide an important base in Europe for developing innovative technologies, products and system solutions for the semiconductors key to powering AI, electric and autonomous vehicles, data centres, as well as supercomputing applications. The plant is expected to reach full capacity in 2033. This OEF status recognition follows four semiconductor projects across the EU which have previously been awarded OEF or IPF (integrated production facility) status in October 2025: ESMC in Germany (OEF) Ams-OSRAM in Austria (IPF) Infineon Technologies Dresden in Germany (IPF) STMicroelectronics in Italy The decision to grant OEF follows the Commission state aid decision concerning Silicon Box. Related topics Advanced Digital Technologies Electronics Chips Act Semiconductors {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}

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