In a recent attack, the group showcased stealthier cross-network activity, thanks to its use of a new BYOVD technique and other tools.
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— Sources secondairesCursorJack shows how malicious MCP deeplinks in Cursor IDE can trigger user-approved code execution
Armis reveals that “mutually assured disruption” is no longer preventing state-backed attacks
Akamai says 87% of organizations suffered an API-related security incident last year
The US Cyber Monitoring Center should be operational in 2027, said the UK CMC leadership
Equipment for smart European cable systems - Works Anonymous (not verified) Tue, 03/17/2026 - 08:45 Opening: 17 March 2026 Closing: 30 June 2026 This call supports the upgrade of existing submarine telecommunications/digital infrastructures to “smart capabilities” enabling applications that monitor them as well as other surrounding critical infrastructures (e.g. power cables, pipelines, etc.) and/or their vicinity. Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}
Backbone connectivity for Digital Global Gateways - Studies Anonymous (not verified) Tue, 03/17/2026 - 08:19 Opening: 17 March 2026 Closing: 30 June 2026 This call for proposals will fund studies related to the deployment/significant upgrade of backbone networks that address risks, vulnerabilities and dependencies in the EU backbone infrastructure. GettyImages © Dragon Claws Main link https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportuni… Related topics Digital connectivity Connecting Europe Facility Funding for Digital {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}
Researchers uncovered an extensive cyber espionage campaign that used novel backdoors and familiar evasion techniques to maintain persistent access to regional targets.
Dozens of updated, malicious GlassWorm extensions have infested Open VSX, threatening software development supply chains.
Discover how Franz Regul, former CISO for the Paris 2024 Olympics, tackled unique cybersecurity challenges to protect the Games from evolving threats.
Drivers in the Russian city of Perm have been enjoying an unexpected bonus this week: free parking. Not because the city council suddenly decided to embrace generosity - but rather because hackers succeeded in knocking the city's payment system offline. Read more in my article on the Hot for Security blog.
Some of these campaigns are linked to Darcula, a Chinese-language phishing-as-a-service platform
A social engineering campaign impersonating PayPal and Amazon uses customer support interactions to acquire sensitive info.
CrackArmor AppArmor flaws let local Linux users gain root, break containers and enable DoS attacks
DNS-based attack in AWS Bedrock AgentCore lets AI sandboxes exfiltrate cloud data
The FBI wants to hear from gamers who have downloaded Steam titles containing malware
An issue with the Companies House website has put the personal and corporate information of millions at risk
Open EU Foundry status granted to innovative chiplet facility Anonymous (not verified) Mon, 03/16/2026 - 10:40 The Commission has granted the Open EU Foundry (OEF) status to Silicon Box in Novara, Italy. GettyImages © Nikola Ilic - E+ Under the European Chips Act, the OEF status is granted to new or upgraded innovative semiconductor manufacturing facilities. The status provides benefits to semiconductor facilities including administrative support, faster construction approvals and priority access to pilot lines under the Chips for Europe Initiative. This helps deepen European semiconductor supply chain resilience and boost innovation. Silicon Box’s project is a significant milestone in strengthening Europe’s semiconductor industry through its new advanced semiconductor packaging and testing facility. The facility will integrate multiple dies or chiplets - small, modular semiconductor blocks that perform specific functions - into a single package, effectively creating a multi-chip module that behaves like a single chip, using panel level packaging. Panel level packaging uses a more efficient large-panel approach to packaging, enabling higher output and lower cost compared to traditional methods in the final stage of the chip making process. The facility will also test chips at panel-level, grouping multiple chiplets into a single panel, enabling more comprehensive quality verification before final assembly. The project will provide an important base in Europe for developing innovative technologies, products and system solutions for the semiconductors key to powering AI, electric and autonomous vehicles, data centres, as well as supercomputing applications. The plant is expected to reach full capacity in 2033. This OEF status recognition follows four semiconductor projects across the EU which have previously been awarded OEF or IPF (integrated production facility) status in October 2025: ESMC in Germany (OEF) Ams-OSRAM in Austria (IPF) Infineon Technologies Dresden in Germany (IPF) STMicroelectronics in Italy The decision to grant OEF follows the Commission state aid decision concerning Silicon Box. Related topics Advanced Digital Technologies Electronics Chips Act Semiconductors {"service":"share","version":"2.0","color":true,"networks":["x","facebook","linkedin","email","more"]}
The excitement around Cisco's latest SD-WAN bugs has inspired some light fraud, misunderstandings, and overlooked potential hazards.
Threat actors target nonprofits due to security gaps and highly coveted information, but a lack of sufficient data makes it difficult to grasp the entire picture.